MORETEC
Wafer Diameter: 200+/-.2mm
Wafer Thickness: 725+/-25μm
Pocket Size: 52 +/-.1mm (Customizable)
Pocket Depth: 300μm +/-30μm (Customizable)
Number of Pockets: 8
Material: Silicon
Wafer Cleaning Process: Hydrofluoric acid cleaning → Pure water immersion cleaning → Pure water shower cleaning → Blow drying
(Above processes are conducted in air environment)"
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